1. 2. 3. material content data sheet sales product name sak-xc2368e-136f128l aa issued 29. august 2013 ma# MA001025844 package pg-lqfp-100-8 weight* 759.86 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 56.102 7.38 7.38 73831 73831 leadframe inorganic material phosphorus 7723-14-0 0.069 0.01 90 non noble metal zinc 7440-66-6 0.275 0.04 362 non noble metal iron 7439-89-6 5.501 0.72 7239 non noble metal copper 7440-50-8 223.351 29.39 30.16 293935 301626 wire noble metal gold 7440-57-5 3.427 0.45 0.45 4510 4510 encapsulation organic material carbon black 1333-86-4 2.234 0.29 2940 plastics epoxy resin - 60.324 7.94 79388 inorganic material silicondioxide 60676-86-0 384.285 50.58 58.81 505730 588058 leadfinish non noble metal tin 7440-31-5 9.288 1.22 1.22 12224 12224 plating noble metal silver 7440-22-4 2.495 0.33 0.33 3283 3283 glue plastics epoxy resin - 3.128 0.41 4117 noble metal silver 7440-22-4 9.385 1.24 1.65 12351 16468 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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